CNMS

Office of Basic Energy Sciences
Office of Science


NANOFABRICATION RESEARCH LABORATORY CAPABILITIES

The Nanofabrication Research Laboratory (NRL) at CNMS includes approximately 10,000 ft2 of clean room space in a bay and chase configuration (see schematic). This clean room space and the capabilities it houses provide support for users in all of the CNMS Scientific Themes. The following capabilities are available in the NRL:

Process Design

  • Assistance with design of process flow to implement users’ device concepts using the facilities housed in the CNMS Nanofabrication Research Laboratory.

E-Beam Lithography

  • State of the art JEOL JBX-9300–100 kV electron beam lithography system for high resolution nanopatterning. Requisite resist processing tools.

Dual-beam SEM/FIB

  • State-of-the-art FEI Nova 600 scanning electron microscope/focused ion beam system for micro- and nanofabrication.

General Cleanroom Use

  • Optical Lithography
    Contact mask aligner system with broadband (405–365 nm) exposure optics. Optical stepper with i-line (365 nm) exposure optics and 5X mask reduction. Laser-based optical mask writer system to support mask development needs.
  • High-Resolution SEM Analysis
    JEOL JSM-7400 field-emission scanning electron microscope.
  • Deep Silicon Etching/ Reactive Ion Etching
    An Oxford 100 DRIE/RIE system capable of Bosch process etching, Cryo processing, and standard RIE dry etching of silicon, silicon oxide, and silicon nitride materials for MEMs, NEMs, and general silicon fabrication.
  • Thermal Oxidation Furnace
    A high temperature wet/dry oxidation furnace is available for the growth of high quality silicon dioxide thin films on silicon substrates.
  • Chemical Vapor Deposition
    Low pressure chemical vapor deposition of SiO2, Si3N4 (low stress), and poly-Si (doped and undoped). Low temperature plasma enhanced chemical vapor deposition of SiO2, Si3N4 and silicon oxy-nitrides.
  • Physical Vapor Deposition
    E-beam evaporation, thermal evaporation, and sputter deposition of metals, semiconductors, and dielectrics.
  • Reactive Ion Etching
    A Technics RIE system is available for dry etching dielectric and polymer materials (future).
  • Spectroscopic Reflectometry
  • Surface Profilometry
  • Electrical Properties Measurements (DC to 6 GHZ)

 

Capabilities provided by other CNMS groups
Macromolecular Nanomaterials
Catalytic Nanosystems
Functional Hybrid Nanostructures
Scanning Probes & Nanoscale Physics
Electron Microscopy, Neutron and X-ray Scattering
Nanomaterials Theory Institute
Bio-Inspired Nanomaterials
General Characterization Facilities
Collaborating Facilities

 



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Updated Sunday, 07-Oct-2007 20:47:47 EDT - 7,582